Cushions calculated from unit weight
A bookshelf speaker or a subwoofer is the hardest pack in consumer audio: dense, heavy, with a large flat face that can deform and a cabinet finish that shows every mark. Off-the-shelf foam corners are usually the weak point, not the product.
We calculate these cushions rather than selecting them, which is the only way to get a heavy pack right:
- Wall thickness from unit mass and drop height, with the material grade chosen to match.
- Centre-of-gravity aware placement - a subwoofer's mass is low and forward, and the cushions have to reflect that.
- Protective cushioning under the cabinet's bottom edge, where almost all the energy from a vertical drop lands.
- Reinforced corner blocks, pressed at full depth rather than formed from bent board.
Because the cushion is pressed to a shape, it also holds the unit square inside the carton, which matters for pallet stacking. A speaker that settles at an angle on a pallet is a pallet that will not stack safely.
MOQ 10,000 pieces per design; tooling 7–15 days, production 15–25 days after sample approval. Send the unit weight, the carton internal dimensions and your drop specification, and we will size the cushion. Or talk to our engineering team.
FAQ
Q: Are you a manufacturer or trading company?
A: We are a manufacturer founded in Hong Kong in 2013, with two production bases in Dongguan, China and Ho Chi Minh City, Vietnam, and a total manufacturing area of 26,000 square meters. You are welcome to visit or audit our factory.
Q: What is your MOQ for custom molded fiber packaging?
A: Our standard MOQ is 10,000 pieces per design. If your project requires a different quantity, contact us at info@csl-packaging.com and we will review the options with you.
Q: What is the production lead time?
A: Lead time is generally 15-25 days after sample approval, depending on order quantity and technical difficulty. The exact schedule is confirmed together with your order.
Q: Can you produce inserts that fit my device exactly?
A: Yes. We custom-mold each insert from your 3D drawing or physical sample, with tight-tolerance wet-pressed options for a precise fit. Samples are provided for approval before mass production.
Q: Is molded fiber packaging suitable for electronics?
A: Yes. Molded fiber is a dry, non-conductive material widely used for consumer electronics packaging, and anti-static options are available. Please specify your ESD requirements when requesting a quote.
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